RAM DDR4 8GB/2666 KINGSTON HYPERX-FURY(HX426C16FB2/8)

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DESCRIPTION

SPECIFICATIONS

*Power will vary depending on the SDRAM used.

HX426C16FB2/8

8GB 1G x 64-Bit

DDR4-2666 CL16 288-Pin DIMM

Continued >>

kingston.com/hyperx

FEATURES

HyperX HX426C16FB2/8 is a 1G x 64-bit (8GB) DDR4-2666 CL16

SDRAM (Synchronous DRAM) 1Rx8, memory module, based on

eight 1G x 8-bit FBGA components per module. Each module

supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0.

Each module has been tested to run at DDR4-2666 at a low latency

timing of 16-18-18 at 1.2V. Additional timing parameters are

shown in the Plug-N-Play (PnP) Timing Parameters section

below. The JEDEC standard electrical and mechanical

specifications are as follows:

CL(IDD)

Row Cycle Time (tRCmin)

Refresh to Active/Refresh

Command Time (tRFCmin)

Row Active Time (tRASmin)

Maximum Operating Power

UL Rating

Operating Temperature

Storage Temperature

16 cycles

45.75ns(min.)

350ns(min.)

29.25ns(min.)

TBD W*

94 V - 0

0o

 C to +85o

 C

-55o

 C to +100o

 C

JEDEC/XMP TIMING PARAMETERS

• JEDEC/PnP: DDR4-2666 CL16-18-18 @1.2V

• XMP Profile #1: DDR4-2666 CL16-18-18 @1.2V

• Power Supply: VDD = 1.2V Typical

• VDDQ = 1.2V Typical

• VPP = 2.5V Typical

• VDDSPD = 2.2V to 3.6V

• Nominal and dynamic on-die termination (ODT) for

 data, strobe, and mask signals

• Low-power auto self refresh (LPASR)

• Data bus inversion (DBI) for data bus

• On-die VREFDQ generation and calibration

• Single-rank

• On-board I2 serial presence-detect (SPD) EEPROM

• 16 internal banks; 4 groups of 4 banks each

• Fixed burst chop (BC) of 4 and burst length (BL) of 8

 via the mode register set (MRS)

• Selectable BC4 or BL8 on-the-fly (OTF)

• Fly-by topology

• Terminated control command and address bus

• Height 1.340” (34.04mm), w/heatsink

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